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PF0030 Series
MOS FET Power Amplifier
ADE-208-460 (Z) 1st Edition July 1996 Features
* High stability: Load VSWR = 20 : 1 * Low power control current: 400 A * Thin package: 5 mmt
Ordering Information
Type No PF0030 PF0032 Operating Frequency 824 to 849 MHz 872 to 905 MHz Application AMPS E-TACS
Pin Arrangement
* RF-B2 5 4 3 2 5 1 1: Pin 2: VAPC 3: VDD 4: Pout 5: GND
PF0030 Series
Internal Diagram and External Circuit
G GND Pin1 Pin Pin2 VAPC Pin3 VDD Pin4 Pout
G GND
Z1
C1
FB1
C3
FB2
C2
Z2
Pin
VAPC
VDD
Pout
C1 = C2 = 0.01 F (Ceramic chip capacitor) C3 = 10 F (Aluminum Electrolyte Capacitor) FB = Ferrite bead BL01RN1-A62-001 (Manufacture: MURATA) or equivalent Z1 = Z2 = 50 (Microstrip line)
Absolute Maximum Ratings (Ta = 25C)
Item Supply voltage Supply current APC voltage Input power Operating case temperature Storage temperature Symbol VDD I DD VAPC Pin Tc (op) Tstg Rating 17 3 8 20 -30 to +110 -40 to +110 Unit V A V mW C C
2
PF0030 Series
Electrical Characteristics (Ta = 25C)
Item Drain cutoff current Total efficiency 2nd harmonic distortion 3rd harmonic distortion Input VSWR Output VSWR Stability Symbol I DS T 2nd H.D. 3rd H.D. VSWR (in) Min -- 35 -- -- -- Typ -- 40 -50 -50 1.5 1.5 Max 500 -- -30 -30 3 -- Unit A % dB dB -- -- -- Pin = 2 mW, VDD = 12.5 V, Pout = 6 W (at APC controlled), Zin = 50 , Output VSWR = 20:1 All phases, t = 20 sec Test Condition VDD = 17 V, VAPC = 0 V Pin = 2 mW, VDD = 12.5 V, Pout = 6 W (at APC controlled) Zin = Zout = 50
VSWR (out) -- --
No parasitic oscillation
Test System Diagram
S.G Power Meter L.P.F 3dB ATT
VAPC VDD Spectrum Analyzer Test Fixture Directional Coupler Directional Coupler
Power Meter
3
PF0030 Series
Test Fixture Pattern
Unit: mm
26.5 3.5 2.88 16 4.5 3 2.88 64 28 4
VAPC
VDD 80 3.5
1.5
2.88
4
4 15 100 Grass Epoxy Double sided PCB (t = 1.6 mm, r = 4.8)
Mechanical Characteristics
Item Torque for screw up the heatsink flange Warp size of the heatsink flange: S Conditions M3 Screw Bolts Spec 4 to 6 kg*cm S=0 +0.3/-0 mm S
4
16.5
4
2.88
PF0030 Series
Note for Use
* * * * * * * * * * * * * * Unevenness and distortion at the surface of the heatsink attached module should be less than 0.05 mm. It should not be existed any dust between module and heatsink. MODULE should be separated from PCB less than 1.5 mm. Soldering temperature and soldering time should be less than 230C, 10 sec. (Soldering position spaced from the root point of the lead frame: 2 mm) Recommendation of thermal joint compounds is TYPE G746. (Manufacturer: Shin-Etsu Chemical, Co., Ltd.) To protect devices from electro-static damage, soldering iron, measuring-equipment and human body etc. should be grounded. Torque for screw up the heatsink flange should be 4 to 6 kg * cm with M3 screw bolts. Don't solder the flange directly. It should make the lead frame as straight as possible. The module should be screwed up before lead soldering. It should not be given mechanical and thermal stress to lead and flange of the module. When the external parts (Isolator, Duplexer, etc.) of the module are changed, the electrical characteristics should be evaluated enough. Don't washing the module except lead pins. To get good stability, ground impedance between the module GND flange and PCB GND pattern should be designed as low as possible.
5
PF0030 Series
Characteristics Curve
PF0030
Pout, T vs. VDD (1) 20 T 16 Output Power Pout (W) 40 Efficiency T (%) Efficiency T (%) 50
12
30
8 Pout 4 f = 824 MHz Pin = 2 mW VAPC = 4 V 0 4 8 12 16 Supply Voltage VDD (V) Pout, T vs. VDD (2) 20
20
10
0
0 20
50
16 Output Power Pout (W) T 12
40
30
8 Pout 4 f = 849 MHz Pin = 2 mW VAPC = 4 V 0 4 8 12 16 Supply Voltage VDD (V)
20
10
0
0 20
6
PF0030 Series
PF0030 (cont)
VAPC, T, VSWR (in) vs. Frequency 6 10 Pin = 2 mW VDD = 12.5 V Pout = 6 W 5 Apc Voltage VAPC (V) 8 T 50 Efficiency T (%) Efficiency T (%) 60
V.S.W.R. (in)
4
6
40
3
4 VAPC 2 VSWRin
30
2
20
1
0 824
829
834
839
844
10 849
Frequency f (MHz) Pout, T, VSWR (in) vs. Frequency 6 20 Pin = 2 mW VDD = 12.5 V VAPC = 4 V T 12 40 60
5 Output Power Pout (W)
16
50
V.S.W.R. (in)
4
3
8 Pout 4 VSWRin
30
2
20
1
0 824
829
834
839
844
10 849
Frequency f (MHz)
7
PF0030 Series
PF0030 (cont)
Pout, T vs. Pin (1) 20 T 60
16 Output Power Pout (W)
50 Efficiency T (%) Efficiency T (%)
12 Pout 8
40
30
4
f = 824 MHz 20 VDD = 12.5 V VAPC = 4 V 0 2 4 6 8 10 10
0
Input Power Pin (mW) Pout, T vs. Pin (2) 20 60
16 Output Power Pout (W)
T
50
12 Pout 8
40
30
4
f = 849 MHz 20 VDD = 12.5 V VAPC = 4 V 0 2 4 6 8 10 10
0
Input Power Pin (mW)
8
PF0030 Series
PF0030 (cont)
Pout, T vs. VAPC (1) 20 T 50
16 Output Power Pout (W)
40 Efficiency T (%) Efficiency T (%)
12 Pout 8
30
20
4
f = 824 MHz Pin = 2 mW VDD = 12.5 V 0 2 4 6 Apc Voltage VAPC (V) Pout, T vs. VAPC (2) 8
10
0
0 10
20 T 16 Output Power Pout (W)
50
40
12 Pout 8
30
20
4
f = 849 MHz Pin = 2 mW VDD = 12.5 V 0 2 4 6 Apc Voltage VAPC (V) 8
10
0
0 10
9
PF0030 Series
PF0030 (cont)
T vs. TC (1) 70 f = 824 MHz 60 Efficiency T (%) VDD = 12.5 V Pin = 2 mW Pout = 6 W
50
40
30
20 -40
0
40
80
120
Case Temperature TC (C) T vs. TC (2) 70 f = 849 MHz 60 Efficiency T (%) VDD = 12.5 V Pin = 2 mW Pout = 6 W
50
40
30
20 -40
0
40
80
120
Case Temperature TC (C)
10
PF0030 Series
PF0030 (cont)
Pout vs. TC (1) f = 824 MHz 20 Output Power Pout (W) VDD = 12.5 V Pin = 2 mW VAPC = 7.0 V
10
0 -40
0
40
80
120
Case Temperature TC (C) Pout vs. TC (2) f = 849 MHz 20 Output Power Pout (W) VDD = 12.5 V Pin = 2 mW VAPC = 7.0 V
10
0 -40
0
40
80
120
Case Temperature TC (C)
11
PF0030 Series
PF0032
Pout, T vs. VDD (1) 20 60
16 Output Power Pout (W) T 12
50 Efficiency T (%) Efficiency T (%)
40
8 Pout 4 f = 872 MHz Pin = 2 mW VAPC = 4 V 0 4 8 12 16 Supply Voltage VDD (V) Pout, T vs. VDD (2) 20
30
20
0
10 20
60
16 Output Power Pout (W)
50
12
T
40
8
30
4
Pout f = 905 MHz Pin = 2 mW VAPC = 4 V
20
0
0
4
8 12 16 Supply Voltage VDD (V)
10 20
12
PF0030 Series
PF0032 (cont)
VAPC, T, VSWR (in) vs. Frequency 6 10 Pin = 2 mW VDD = 12.5 V Pout = 6 W 5 Apc Voltage VAPC (V) 8 T 6 40 Efficiency T (%) Efficiency T (%) 50 60
V.S.W.R. (in)
4
3
4 VAPC 2 VSWRin
30
2
20
1
0 872
883
894
10 905
Frequency f (MHz) Pout, T, VSWR (in) vs. Frequency 6 20 Pin = 2 mW VDD = 12.5 V VAPC = 4 V T 12 40 60
5 Output Power Pout (W)
16
50
V.S.W.R. (in)
4
3
8 Pout 4 VSWRin
30
2
20
1
0 872
883
894
10 905
Frequency f (MHz)
13
PF0030 Series
PF0032 (cont)
Pout, T vs. Pin (1) 20 60
16 Output Power Pout (W)
T
50 Efficiency T (%) Efficiency T (%)
12 Pout 8
40
30
4
f = 872 MHz 20 VDD = 12.5 V VAPC = 4 V 0 2 4 6 Input Power Pin (mW) Pout, T vs. Pin (2) 8 10 10
0
20
60
16 Output Power Pout (W) T
50
12
40
8
Pout
30
4
f = 905 MHz 20 VDD = 12.5 V VAPC = 4 V 0 2 4 6 Input Power Pin (mW) 8 10 10
0
14
PF0030 Series
PF0032 (cont)
Pout, T vs. VAPC (1) 20 60
16 Output Power Pout (W) T 12 Pout 8
50 Efficiency T (%) Efficiency T (%)
40
30
4
f = 872 MHz Pin = 2 mW VDD = 12.5 V 0 2 4 6 Apc Voltage VAPC (V) Pout, T vs. VAPC (2) 8
20
0
10 10
20
60
16 Output Power Pout (W)
50
12 T 8 Pout 4 f = 905 MHz Pin = 2 mW VDD = 12.5 V 0 2 4 6 Apc Voltage VAPC (V) 8
40
30
20
0
10 10
15
PF0030 Series
PF0032 (cont)
T vs. TC (1) 70 f = 872 MHz 60 Efficiency T (%) VDD = 12.5 V Pin = 2 mW Pout = 6 W
50
40
30
20 -40
0
40
80
120
Case Temperature TC (C) T vs. TC (2) 70 f = 905 MHz 60 Total Efficiency T (%) VDD = 12.5 V Pin = 2 mW Pout = 6 W
50
40
30
20 -40
0
40
80
120
Case Temperature TC (C)
16
PF0030 Series
PF0032 (cont)
Pout vs. TC (1) f = 872 MHz 20 Output Power Pout (W) VDD = 12.5 V Pin = 2 mW VAPC = 7.0 V
10
0 -40
0
40
80
120
Case Temperature TC (C) Pout vs. TC (2) f = 905 MHz 20 Output Power Pout (W) VDD = 12.5 V Pin = 2 mW VAPC = 7.0 V
10
0 -40
0
40
80
120
Case Temperature TC (C)
17
PF0030 Series
Package Dimensions
Unit: mm
12.7 0.5
11.0 0.3
60.5 0.5 57.5 0.5
R1.6
0.5
0.6 5.0 + 0.3 -
2.3
13.0 1
9.2 1 8.0 1
Hitachi Code JEDEC EIAJ Weight (reference value) RF-B2 -- -- 16 g
18
0.25
22.0 1
3.3
49.8 0.5
51
1
2
3
4
6.35 0.5
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
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Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.

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